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Sources at IBM say that product development kits based on the company’s work developing silicon photonics engines for high-speed data center and server connectivity are nearing the alpha stage and should reach full technology qualification next year. The company is now willing to engage potential partners interested in turning the technology into products.
EXFO Inc. (NASDAQ: EXFO, TSX: EXF) has introduced the FVA-3800 multiport benchtop optical variable attenuator, which the company claims is the most compact device on the market. EXFO says it is the ideal solution for bit error rate (BER) testing and system verification in labs or manufacturing environments.
ColorChip Ltd. plans to demonstrate a 100-Gbps (4x25 Gbps) high-speed optical transceiver for data center, high-performance computing, and enterprise applications at OFC 2014 this week. The transceiver is implemented in a pluggable quad small form-factor (QSFP28) package and operates via singlemode fiber over a 2-km reach.